MOLDTKPAC corporate events summary

Mold-Tek Packaging Ltd has 47 corporate events on record; the most recent was a bonus issue dated 9 Oct 2026. The latest dividend was ₹1.5 per share with an ex-date of 11 Sept 2026. 2 dividends were paid in the last 12 months, totalling ₹2.5 per share. The most recent bonus issue was dated 9 Oct 2026, at a ratio of 1:1. The next scheduled event is a quarterly results announcement on 2 Nov 2026.